multilayer ceramic chip capacitors 1 of 3 creation date : february 16, 2017 (gmt) c1608x7r2a102m080aa tdk item description c1608x7r2a102mt**** applications commercial grade please refer to part no. cga3e2x7r2a102m080aa for automotive use. feature mid mid voltage (100 to 630v) series c1608 [eia 0603] status production size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 1nf 20% rated voltage 100vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : february 16, 2017 (gmt) c1608x7r2a102m080aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608x7r2a102m080aa esr c1608x7r2a102m080aa capacitance c1608x7r2a102m080aa dc bias characteristic c1608x7r2a102m080aa temperature characteristic c1608x7r2a102m080aa(no bias) c1608x7r2a102m080aa(dc bias = 50v ) ripple temperature rising c1608x7r2a102m080aa(100khz) c1608x7r2a102m080aa(500khz) c1608x7r2a102m080aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : february 16, 2017 (gmt) c1608x7r2a102m080aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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